JPS629732Y2 - - Google Patents
Info
- Publication number
- JPS629732Y2 JPS629732Y2 JP9830682U JP9830682U JPS629732Y2 JP S629732 Y2 JPS629732 Y2 JP S629732Y2 JP 9830682 U JP9830682 U JP 9830682U JP 9830682 U JP9830682 U JP 9830682U JP S629732 Y2 JPS629732 Y2 JP S629732Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- package
- metallized film
- metal frame
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000011104 metalized film Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9830682U JPS593548U (ja) | 1982-06-30 | 1982-06-30 | 半導体装置用パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9830682U JPS593548U (ja) | 1982-06-30 | 1982-06-30 | 半導体装置用パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS593548U JPS593548U (ja) | 1984-01-11 |
| JPS629732Y2 true JPS629732Y2 (en]) | 1987-03-06 |
Family
ID=30233468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9830682U Granted JPS593548U (ja) | 1982-06-30 | 1982-06-30 | 半導体装置用パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593548U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61203523U (en]) * | 1985-06-12 | 1986-12-22 |
-
1982
- 1982-06-30 JP JP9830682U patent/JPS593548U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS593548U (ja) | 1984-01-11 |
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